Characterization of copper chemical mechanical polishing induced defects

Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry.

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Bibliographic Details
Main Author: Teo, Tai Yong.
Other Authors: Goh, Wang Ling
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/3564
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Institution: Nanyang Technological University

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