Electroless copper plating for ULSI applications
This thesis presents the electroless copper deposition process and characterization of the deposited copper films. The electroless deposition parameters were optimized by evaluating the influence of chemical compositions, processing temperature and pH value.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/4733 |
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| Institution: | Nanyang Technological University |