Electroless copper plating for ULSI applications

This thesis presents the electroless copper deposition process and characterization of the deposited copper films. The electroless deposition parameters were optimized by evaluating the influence of chemical compositions, processing temperature and pH value.

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Bibliographic Details
Main Author:	Liu, Kaiyu.
Other Authors:	Goh, Wang Ling
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
Online Access:	http://hdl.handle.net/10356/4733
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-4733
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spelling	sg-ntu-dr.10356-47332023-07-04T15:21:58Z Electroless copper plating for ULSI applications Liu, Kaiyu. Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials This thesis presents the electroless copper deposition process and characterization of the deposited copper films. The electroless deposition parameters were optimized by evaluating the influence of chemical compositions, processing temperature and pH value. Master of Engineering 2008-09-17T09:57:31Z 2008-09-17T09:57:31Z 2001 2001 Thesis http://hdl.handle.net/10356/4733 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials Liu, Kaiyu. Electroless copper plating for ULSI applications
description	This thesis presents the electroless copper deposition process and characterization of the deposited copper films. The electroless deposition parameters were optimized by evaluating the influence of chemical compositions, processing temperature and pH value.
author2	Goh, Wang Ling
author_facet	Goh, Wang Ling Liu, Kaiyu.
format	Theses and Dissertations
author	Liu, Kaiyu.
author_sort	Liu, Kaiyu.
title	Electroless copper plating for ULSI applications
title_short	Electroless copper plating for ULSI applications
title_full	Electroless copper plating for ULSI applications
title_fullStr	Electroless copper plating for ULSI applications
title_full_unstemmed	Electroless copper plating for ULSI applications
title_sort	electroless copper plating for ulsi applications
publishDate	2008
url	http://hdl.handle.net/10356/4733
_version_	1772825367095017472

Electroless copper plating for ULSI applications

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