Integration of electroless copper and electrolytic copper plating

• Main Author: Tan, Kee Tchuan.
• Other Authors: Goh, Wang Ling
• Format: Theses and Dissertations
• Published: 2008
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
• Online Access: http://hdl.handle.net/10356/3366
• Institution: Nanyang Technological University

This thesis presents our findings on the electroless Cu seed deposition process as well as its integration to mainstream Cu electroplating bulk-fill. Initial works include formulating (in-house) a suitable electronless Cu bath composition, and identifying appropriate catalyzation techniques to initi...