Integration of electroless copper and electrolytic copper plating

This thesis presents our findings on the electroless Cu seed deposition process as well as its integration to mainstream Cu electroplating bulk-fill. Initial works include formulating (in-house) a suitable electronless Cu bath composition, and identifying appropriate catalyzation techniques to initi...

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Bibliographic Details
Main Author:	Tan, Kee Tchuan.
Other Authors:	Goh, Wang Ling
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Online Access:	http://hdl.handle.net/10356/3366
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Institution:	Nanyang Technological University

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spelling	sg-ntu-dr.10356-33662023-07-04T15:20:57Z Integration of electroless copper and electrolytic copper plating Tan, Kee Tchuan. Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Semiconductors This thesis presents our findings on the electroless Cu seed deposition process as well as its integration to mainstream Cu electroplating bulk-fill. Initial works include formulating (in-house) a suitable electronless Cu bath composition, and identifying appropriate catalyzation techniques to initiate the electronless Cu film growth. Master of Engineering 2008-09-17T09:28:29Z 2008-09-17T09:28:29Z 2002 2002 Thesis http://hdl.handle.net/10356/3366 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Semiconductors Tan, Kee Tchuan. Integration of electroless copper and electrolytic copper plating
description	This thesis presents our findings on the electroless Cu seed deposition process as well as its integration to mainstream Cu electroplating bulk-fill. Initial works include formulating (in-house) a suitable electronless Cu bath composition, and identifying appropriate catalyzation techniques to initiate the electronless Cu film growth.
author2	Goh, Wang Ling
author_facet	Goh, Wang Ling Tan, Kee Tchuan.
format	Theses and Dissertations
author	Tan, Kee Tchuan.
author_sort	Tan, Kee Tchuan.
title	Integration of electroless copper and electrolytic copper plating
title_short	Integration of electroless copper and electrolytic copper plating
title_full	Integration of electroless copper and electrolytic copper plating
title_fullStr	Integration of electroless copper and electrolytic copper plating
title_full_unstemmed	Integration of electroless copper and electrolytic copper plating
title_sort	integration of electroless copper and electrolytic copper plating
publishDate	2008
url	http://hdl.handle.net/10356/3366
_version_	1772825228923109376

Integration of electroless copper and electrolytic copper plating

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