Characterization of copper chemical mechanical polishing induced defects

Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry.

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Bibliographic Details
Main Author:	Teo, Tai Yong.
Other Authors:	Goh, Wang Ling
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Online Access:	http://hdl.handle.net/10356/3564
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3564
record_format	dspace
spelling	sg-ntu-dr.10356-35642023-07-04T15:49:43Z Characterization of copper chemical mechanical polishing induced defects Teo, Tai Yong. Goh, Wang Ling School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry. Master of Engineering 2008-09-17T09:32:31Z 2008-09-17T09:32:31Z 2004 2004 Thesis http://hdl.handle.net/10356/3564 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials Teo, Tai Yong. Characterization of copper chemical mechanical polishing induced defects
description	Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry.
author2	Goh, Wang Ling
author_facet	Goh, Wang Ling Teo, Tai Yong.
format	Theses and Dissertations
author	Teo, Tai Yong.
author_sort	Teo, Tai Yong.
title	Characterization of copper chemical mechanical polishing induced defects
title_short	Characterization of copper chemical mechanical polishing induced defects
title_full	Characterization of copper chemical mechanical polishing induced defects
title_fullStr	Characterization of copper chemical mechanical polishing induced defects
title_full_unstemmed	Characterization of copper chemical mechanical polishing induced defects
title_sort	characterization of copper chemical mechanical polishing induced defects
publishDate	2008
url	http://hdl.handle.net/10356/3564
_version_	1772828873488072704

Characterization of copper chemical mechanical polishing induced defects

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