Optimization of tungsten chemical mechanical polishing process
In this project, the W-CMP process was improved by extending the polishing pad life by 3 times by evaluating on the 3M diamond conditioner as compared to the standard hard brush conditioner. Furthermore, the effect of Thomas West Inc TW711 hard pad on the reduction of large tungsten area Metal-Insul...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/3342 |
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| Institution: | Nanyang Technological University |