Optimization of tungsten chemical mechanical polishing process

• المؤلف الرئيسي: Tan, Eng Hoe.
• مؤلفون آخرون: Tse, Man Siu
• التنسيق: Theses and Dissertations
• منشور في: 2008
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/3342
• المؤسسة: Nanyang Technological University

In this project, the W-CMP process was improved by extending the polishing pad life by 3 times by evaluating on the 3M diamond conditioner as compared to the standard hard brush conditioner. Furthermore, the effect of Thomas West Inc TW711 hard pad on the reduction of large tungsten area Metal-Insul...