Application of chemical mechanical polishing for sub-micron semiconductor device fabrication

• Main Author: Goh, Hua Kooi.
• Other Authors: Higelin, Gerald
• Format: Theses and Dissertations
• Language: English
• Published: 2008
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: http://hdl.handle.net/10356/5050
• Institution: Nanyang Technological University

This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance.