Application of chemical mechanical polishing for sub-micron semiconductor device fabrication

This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance.

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Bibliographic Details
Main Author:	Goh, Hua Kooi.
Other Authors:	Higelin, Gerald
Format:	Theses and Dissertations
Language:	English
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Online Access:	http://hdl.handle.net/10356/5050
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Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-5050
record_format	dspace
spelling	sg-ntu-dr.10356-50502020-06-01T11:56:47Z Application of chemical mechanical polishing for sub-micron semiconductor device fabrication Goh, Hua Kooi. Higelin, Gerald School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance. Master of Applied Science 2008-09-17T10:18:27Z 2008-09-17T10:18:27Z 2001 2001 Thesis http://hdl.handle.net/10356/5050 en Nanyang Technological University 149 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
country	Singapore
collection	DR-NTU
language	English
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials Goh, Hua Kooi. Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
description	This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance.
author2	Higelin, Gerald
author_facet	Higelin, Gerald Goh, Hua Kooi.
format	Theses and Dissertations
author	Goh, Hua Kooi.
author_sort	Goh, Hua Kooi.
title	Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
title_short	Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
title_full	Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
title_fullStr	Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
title_full_unstemmed	Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
title_sort	application of chemical mechanical polishing for sub-micron semiconductor device fabrication
publishDate	2008
url	http://hdl.handle.net/10356/5050
_version_	1681058779058143232

Application of chemical mechanical polishing for sub-micron semiconductor device fabrication

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