Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance.
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5050 |
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| Institution: | Nanyang Technological University |
| Language: | English |