3D current path in stacked devices : metrics and challenges

• Main Authors: Kor, H. B., Infante, F., Perdu, P., Gan, C. L., Lewis, D.
• Other Authors: School of Materials Science & Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: https://hdl.handle.net/10356/94301; http://hdl.handle.net/10220/7250
• Institution: Nanyang Technological University

Although magnetic current imaging (MCI) is useful in fault isolation of devices with 2D current distributions, MCI alone cannot give the exact information of current paths in complex 3D stacked devices. Previous work has demonstrated the ability of a simulation approach to find a short circuit in 3D...