De-layering of copper and low-k dielectrics for semiconductor devices failure analysis

• 主要作者: Ng, Mei Zhen.
• 其他作者: Gan Chee Lip
• 格式: Final Year Project
• 語言: English
• 出版: 2010
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• 在線閱讀: http://hdl.handle.net/10356/38706
• 機構: Nanyang Technological University

This project aims to quantify the rate of copper de-layered during Chemical Mechanical Polishing for semiconductor devices. This is to improve the effectiveness of de-layering copper during failure analysis since copper is prone to smearing, erosion and dishing. The report is generally divided into...