De-layering of copper and low-k dielectrics for semiconductor devices failure analysis

• Main Author: Ng, Mei Zhen.
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: http://hdl.handle.net/10356/38706
• Institution: Nanyang Technological University

This project aims to quantify the rate of copper de-layered during Chemical Mechanical Polishing for semiconductor devices. This is to improve the effectiveness of de-layering copper during failure analysis since copper is prone to smearing, erosion and dishing. The report is generally divided into...