Machining of 2D materials by ultrasonic embossing
The discovery of two-dimensional (2D) materials (E.g., Graphene, Phosphorene and Xenes) in 2004 highlighted the in-plane interatomic interactions displayed in the crystalline materials to be much stronger compared to those along the stacking direction. 2D materials like Graphene exhibit except...
Saved in:
Main Author: | Leow, Teng Wee |
---|---|
Other Authors: | Hong Li |
Format: | Final Year Project |
Language: | English |
Published: |
Nanyang Technological University
2023
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/164135 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Machining of 2D material by ultrasonic embossing
by: Seow, Colvis Wei Chen
Published: (2023) -
Machining of 2D materials by ultrasonic embossing
by: Er, Kenwealth Quan Sheng
Published: (2022) -
Patterning of 2D materials by ultrasonic embossing
by: Tang, Tiffany Yee
Published: (2024) -
Particle size reduction using ultrasonic embossing
by: Shuek, Ezra Jin Hao
Published: (2021) -
Improving ultrasonic embossing process of copper nanowire
by: Gui, Keith Zhi Peng
Published: (2020)