Higher-order topological states in thermal diffusion

• Main Authors: Wu, Haotian, Hu, Hao, Wang, Xixi, Xu, Zhixia, Zhang, Baile, Wang, Qi Jie, Zheng, Yuanjin, Zhang, Jingjing, Cui, Tie Jun, Luo, Yu
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2023
• Subjects: Science::Physics; Amorphous Deformation; Thermal Functional Material
• Online Access: https://hdl.handle.net/10356/164825
• Institution: Nanyang Technological University

Unlike conventional topological materials that carry topological states at their boundaries, higher-order topological materials are able to support topological states at boundaries of boundaries, such as corners and hinges. While band topology has been recently extended into thermal diffusion for th...