Higher-order topological states in thermal diffusion

Unlike conventional topological materials that carry topological states at their boundaries, higher-order topological materials are able to support topological states at boundaries of boundaries, such as corners and hinges. While band topology has been recently extended into thermal diffusion for th...

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Bibliographic Details
Main Authors: Wu, Haotian, Hu, Hao, Wang, Xixi, Xu, Zhixia, Zhang, Baile, Wang, Qi Jie, Zheng, Yuanjin, Zhang, Jingjing, Cui, Tie Jun, Luo, Yu
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2023
Subjects:
Online Access:https://hdl.handle.net/10356/164825
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Institution: Nanyang Technological University
Language: English
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