Dynamic damage analysis of thin film stacked structures for microelectronic devices
In the context of the megatrends of remote working, the development of artificial intelligence, and electric vehicle applications, there is a great demand for better-performing and multi-functional integrated circuit (IC) chips to fill the technology gaps. Moreover, the demand for package minimizati...
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| 格式: | Thesis-Doctor of Philosophy |
| 語言: | English |
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Nanyang Technological University
2023
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/164832 |
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