Investigation of mechanical stress-induced failure in transfer-bonded vertically aligned carbon nanotube arrays
As society increasingly embraces the digital world, technological progress is inevitable. With the proliferation of technology, the demand for advanced electronic devices that are both high-performing and portable is rising. This presents a challenge in terms of protecting these devices from elec...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
Nanyang Technological University
2023
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| Online Access: | https://hdl.handle.net/10356/167396 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | As society increasingly embraces the digital world, technological progress is inevitable.
With the proliferation of technology, the demand for advanced electronic devices that are
both high-performing and portable is rising. This presents a challenge in terms of
protecting these devices from electromagnetic interference using conventional methods.
Carbon nanotubes have been identified as a potential alternative material for
electromagnetic shielding. However, directly synthesizing carbon nanotubes onto
microelectronic devices is not practical due to the high temperature required. As a result,
a new transfer technique for carbon nanotubes is being investigated. This project focuses
on the characterisation and optimisation of a novel carbon nanotube transfer technique
based on of mechanical stress-induced failure analyses. Scanning Electron Microscopy is
utilized for characterization. Multiple process parameters such as growth duration, etch
durations, thickness of gold, spacer height and spacer material choices are examined
throughout this project. In conclusion, the results of conductivity and bonding strength
are analyzed and discussed. |
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