Investigation of mechanical stress-induced failure in transfer-bonded vertically aligned carbon nanotube arrays

Investigation of mechanical stress-induced failure in transfer-bonded vertically aligned carbon nanotube arrays

As society increasingly embraces the digital world, technological progress is inevitable. With the proliferation of technology, the demand for advanced electronic devices that are both high-performing and portable is rising. This presents a challenge in terms of protecting these devices from elec...

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書目詳細資料
主要作者:	Zhai, Yiming
其他作者:	Tay Beng Kang
格式:	Final Year Project
語言:	English
出版:	Nanyang Technological University 2023
主題:	Engineering::Electrical and electronic engineering
在線閱讀:	https://hdl.handle.net/10356/167396
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	Nanyang Technological University
語言:	English

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