Nanoindentation and strain rate effects on hardness of solder materials

• 主要作者: Toh, Jyh Terng.
• 其他作者: Pang Hock Lye, John
• 格式: Final Year Project
• 語言: English
• 出版: 2009
• 主題: DRNTU::Engineering::Manufacturing
• 在線閱讀: http://hdl.handle.net/10356/16806

In this report, three solder materials, SAC387, Pure Sn and Sn-37Pb, underwent nanoindentation testing for hardness and yield stress values at strain rates 0.01/s, 0.1/s, 1.0/s and 10.0/s using the Continuous Stiffness Measurement (CSM) technique. Results show that all three solder materials are s...