Nanoindentation and strain rate effects on hardness of solder materials
In this report, three solder materials, SAC387, Pure Sn and Sn-37Pb, underwent nanoindentation testing for hardness and yield stress values at strain rates 0.01/s, 0.1/s, 1.0/s and 10.0/s using the Continuous Stiffness Measurement (CSM) technique. Results show that all three solder materials are s...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/16806 |
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| Institution: | Nanyang Technological University |
| Language: | English |