Nanoindentation and strain rate effects on hardness of solder materials

• المؤلف الرئيسي: Toh, Jyh Terng.
• مؤلفون آخرون: Pang Hock Lye, John
• التنسيق: Final Year Project
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Manufacturing
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/16806

In this report, three solder materials, SAC387, Pure Sn and Sn-37Pb, underwent nanoindentation testing for hardness and yield stress values at strain rates 0.01/s, 0.1/s, 1.0/s and 10.0/s using the Continuous Stiffness Measurement (CSM) technique. Results show that all three solder materials are s...