Heat transfer analysis of copper wire extrusion and embedding process via filament extrusion technique for 3D printing applications

• Main Author: Muhammad Azri Bin Amir
• Other Authors: Yeong Wai Yee
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2023
• Subjects: Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/168282
• Institution: Nanyang Technological University

The introduction of wire embedding into Additive Manufacturing processes develops the potential to integrate electrical functions into the component. The use of copper wire in 3D printing applications has gained significant interest due to its material properties such as high thermal and electrical conductivity. However, the extrusion and embedding of wire in a 3D printing process requires careful consideration due to the heat transfer process involved. This paper aims to perform a comprehensive heat transfer analysis of the copper wire extrusion and embedding process and will involve a detailed analysis of the temperature distribution in the wire, substrate and printing environment during the process. In order to develop on the current extrusion and embedding process, the printing parameters will be altered and tested to analyse and study the difference in heat transfer analysis outcome. The results of this analysis will provide insights into the heat transfer mechanisms involved and will help in the optimization of the process parameters in order to achieve high-quality prints with minimal defects. The key findings from this study were that the current dwell time could be shortened, wire extrusion length and nozzle temperature could be increased. The improved parameters will help optimize the copper wire laying and embedding process. This study will also contribute to the broader understanding of heat transfer in additive manufacturing processes. This will prove to be essential for the development of a more efficient and reliable 3D printing technology.