Heat transfer analysis of copper wire extrusion and embedding process via filament extrusion technique for 3D printing applications

• Main Author: Muhammad Azri Bin Amir
• Other Authors: Yeong Wai Yee
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2023
• Subjects: Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/168282
• Institution: Nanyang Technological University

The introduction of wire embedding into Additive Manufacturing processes develops the potential to integrate electrical functions into the component. The use of copper wire in 3D printing applications has gained significant interest due to its material properties such as high thermal and elect...