A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions

• Main Authors: Sun, Weifeng, Chern, Wen Kwang, Chan, John Chok You, Chen, Zhong
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2023
• Subjects: Engineering::Electrical and electronic engineering; Epoxy Resin; Partial Discharge
• Online Access: https://hdl.handle.net/10356/168785
• Institution: Nanyang Technological University

To reveal the microscopic mechanism of synergetic thermal-electrical degradation during a partial discharge process in epoxy insulation materials, the decomposition of crosslinked epoxy resin is investigated using reactive molecular dynamics simulations under high electric field and thermal degradat...