A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions

To reveal the microscopic mechanism of synergetic thermal-electrical degradation during a partial discharge process in epoxy insulation materials, the decomposition of crosslinked epoxy resin is investigated using reactive molecular dynamics simulations under high electric field and thermal degradat...

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Main Authors: Sun, Weifeng, Chern, Wen Kwang, Chan, John Chok You, Chen, Zhong
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2023
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Online Access:https://hdl.handle.net/10356/168785
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-1687852023-06-23T15:40:27Z A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions Sun, Weifeng Chern, Wen Kwang Chan, John Chok You Chen, Zhong School of Electrical and Electronic Engineering School of Materials Science and Engineering SP Group-NTU Joint Laboratory Engineering::Electrical and electronic engineering Epoxy Resin Partial Discharge To reveal the microscopic mechanism of synergetic thermal-electrical degradation during a partial discharge process in epoxy insulation materials, the decomposition of crosslinked epoxy resin is investigated using reactive molecular dynamics simulations under high electric field and thermal degradation conditions. Bond-boost acceleration method is employed in reactive molecular dynamics simulations to successfully establish epoxy polymer models with a crosslink degree of 93%. Active molecular species derived from electrical partial discharges are considered in the current work. Small molecule products and decomposition temperature in the degradation process under an electric field are calculated to elucidate the effect of nitric acid and ozone molecules, being the active products generated by electrical partial discharges, on the synergetic thermal-electrical degradation of epoxy resin. Both nitric acid and ozone exacerbate thermal impact decomposition of crosslinked epoxy polymer by decreasing initial decomposition temperature from 1050 K to 940 K and 820 K, respectively. It is found that these active products can oxidize hydroxyl groups and carbon-nitrogen bridge bonds in epoxy molecular chains, leading to the aggravation of epoxy resin decomposition, as manifested by the significant increase in the decomposed molecular products. In contrast, thermal degradation of the epoxy resin without the active species is not expedited by increasing electric field. These strongly oxidative molecules are easily reduced to negative ions and able to obtain kinetic energies from electric field, which result in chemical corrosion and local temperature increase to accelerate decomposition of epoxy insulation materials. Energy Market Authority (EMA) Nanyang Technological University National Research Foundation (NRF) Published version This research was funded by the National Research Foundation, SP Group, Energy Market Authority of Singapore and Nanyang Technological University under Energy Programme (Grant No. EMA-EP010-SNJL-002). 2023-06-19T06:20:56Z 2023-06-19T06:20:56Z 2023 Journal Article Sun, W., Chern, W. K., Chan, J. C. Y. & Chen, Z. (2023). A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions. Polymers, 15(3), 765-. https://dx.doi.org/10.3390/polym15030765 2073-4360 https://hdl.handle.net/10356/168785 10.3390/polym15030765 36772066 2-s2.0-85147973839 3 15 765 en EMA-EP010-SNJL-002 Polymers © 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Electrical and electronic engineering
Epoxy Resin
Partial Discharge
spellingShingle Engineering::Electrical and electronic engineering
Epoxy Resin
Partial Discharge
Sun, Weifeng
Chern, Wen Kwang
Chan, John Chok You
Chen, Zhong
A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions
description To reveal the microscopic mechanism of synergetic thermal-electrical degradation during a partial discharge process in epoxy insulation materials, the decomposition of crosslinked epoxy resin is investigated using reactive molecular dynamics simulations under high electric field and thermal degradation conditions. Bond-boost acceleration method is employed in reactive molecular dynamics simulations to successfully establish epoxy polymer models with a crosslink degree of 93%. Active molecular species derived from electrical partial discharges are considered in the current work. Small molecule products and decomposition temperature in the degradation process under an electric field are calculated to elucidate the effect of nitric acid and ozone molecules, being the active products generated by electrical partial discharges, on the synergetic thermal-electrical degradation of epoxy resin. Both nitric acid and ozone exacerbate thermal impact decomposition of crosslinked epoxy polymer by decreasing initial decomposition temperature from 1050 K to 940 K and 820 K, respectively. It is found that these active products can oxidize hydroxyl groups and carbon-nitrogen bridge bonds in epoxy molecular chains, leading to the aggravation of epoxy resin decomposition, as manifested by the significant increase in the decomposed molecular products. In contrast, thermal degradation of the epoxy resin without the active species is not expedited by increasing electric field. These strongly oxidative molecules are easily reduced to negative ions and able to obtain kinetic energies from electric field, which result in chemical corrosion and local temperature increase to accelerate decomposition of epoxy insulation materials.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Sun, Weifeng
Chern, Wen Kwang
Chan, John Chok You
Chen, Zhong
format Article
author Sun, Weifeng
Chern, Wen Kwang
Chan, John Chok You
Chen, Zhong
author_sort Sun, Weifeng
title A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions
title_short A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions
title_full A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions
title_fullStr A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions
title_full_unstemmed A reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions
title_sort reactive molecular dynamics study on crosslinked epoxy resin decomposition under high electric field and thermal aging conditions
publishDate 2023
url https://hdl.handle.net/10356/168785
_version_ 1772826633779019776