Bandgap technology and process development for genetic InP monolithic integration

The increasing complexity of next-generation optical communications systems and networking architectures requires more components to be integrated on a single chip, forming photonic integrated circuits (PICs), in order to enhance the performance and reliability, and increase the functionality whil...

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Bibliographic Details
Main Author: Mei Ting.
Other Authors: School of Electrical and Electronic Engineering
Format: Research Report
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/16936
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Institution: Nanyang Technological University
Language: English