Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power

Complementary metal oxide semiconductor-compatible short- and midwave infrared emitters are highly coveted for the monolithic integration of silicon-based photonic and electronic integrated circuits to serve a myriad of applications in sensing and communication. In this regard, the group IV germaniu...

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Main Authors: Atalla, Mahmoud R. M., Kim, Youngmin, Assali, Simone, Burt, Daniel, Nam, Donguk, Moutanabbir, Oussama
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2023
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Online Access:https://hdl.handle.net/10356/169820
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-1698202023-11-03T15:40:13Z Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power Atalla, Mahmoud R. M. Kim, Youngmin Assali, Simone Burt, Daniel Nam, Donguk Moutanabbir, Oussama School of Electrical and Electronic Engineering Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics Light Emitting Diodes Germanium Tin Semiconductors Complementary metal oxide semiconductor-compatible short- and midwave infrared emitters are highly coveted for the monolithic integration of silicon-based photonic and electronic integrated circuits to serve a myriad of applications in sensing and communication. In this regard, the group IV germanium-tin (GeSn) material epitaxially grown on silicon (Si) emerges as a promising platform to implement tunable infrared light emitters. Indeed, upon increasing the Sn content, the bandgap of GeSn narrows and becomes direct, making this material system suitable for developing an efficient silicon-compatible emitter. With this perspective, microbridge PIN GeSn LEDs with a small footprint of 1520 μm2 are demonstrated, and their operation performance is investigated. The spectral analysis of the electroluminescence emission exhibits a peak at 2.31 μm, and it red-shifts slightly as the driving current increases. It is found that the microbridge LED operates at a dissipated power as low as 10.8 W at room temperature and just 3 W at 80 K. This demonstrated low operation power is comparable to that reported for LEDs having a significantly larger footprint reaching 106 μm2. The efficient thermal dissipation of the current design helped reduce the heat-induced optical losses, thus enhancing light emission. Further performance improvements are envisioned through thermal and optical simulations of the microbridge design. These simulations indicate that the use of GeSn-on-insulator substrate for developing a similar microbridge device is expected to improve the optical confinement toward the realization of electrically driven GeSn lasers. Agency for Science, Technology and Research (A*STAR) Ministry of Education (MOE) National Research Foundation (NRF) The work carried out in Montréal was supported by Natural Science and Engineering Research Council of Canada (Discovery, SPG, and CRD Grants), Canada Research Chairs, Canada Foundation for Innovation, Mitacs, PRIMA Québec, Defense Canada (Innovation for Defense Excellence and Security, IDEaS), the European Union’s Horizon Europe research and innovation program under grant agreement No 101070700 (MIRAQLS), and the U.S. Army Research Office Grant No. W911NF-22-1-0277. The research performed at Nanyang Technological University was supported by Ministry of Education of Singapore (grants AcRF TIER 1 2019-T1-002-050 (RG 148/19 (S)) and AcRF TIER 2 (MOE2018-T2-2-011 (S))), the National Research Foundation of Singapore through the Competitive Research Program (NRF-CRP19-2017-01) and the NRF-ANR Joint Grant (NRF2018-NRF-ANR009 TIGER), and the iGrant of Singapore A*STAR AME IRG (A2083c0053). 2023-08-16T08:10:49Z 2023-08-16T08:10:49Z 2023 Journal Article Atalla, M. R. M., Kim, Y., Assali, S., Burt, D., Nam, D. & Moutanabbir, O. (2023). Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power. ACS Photonics, 10(5), 1649-1653. https://dx.doi.org/10.1021/acsphotonics.3c00310 2330-4022 https://hdl.handle.net/10356/169820 10.1021/acsphotonics.3c00310 2-s2.0-85154068472 5 10 1649 1653 en MOE2019-T1-002-050 (RG 148/19 (S)) MOE2018-T2-2-011 (S) NRF-CRP19-2017-01 NRF2018-NRF-ANR009 TIGER A2083c0053 ACS Photonics © 2023 American Chemical Society. All rights reserved. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics
Light Emitting Diodes
Germanium Tin Semiconductors
spellingShingle Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics
Light Emitting Diodes
Germanium Tin Semiconductors
Atalla, Mahmoud R. M.
Kim, Youngmin
Assali, Simone
Burt, Daniel
Nam, Donguk
Moutanabbir, Oussama
Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power
description Complementary metal oxide semiconductor-compatible short- and midwave infrared emitters are highly coveted for the monolithic integration of silicon-based photonic and electronic integrated circuits to serve a myriad of applications in sensing and communication. In this regard, the group IV germanium-tin (GeSn) material epitaxially grown on silicon (Si) emerges as a promising platform to implement tunable infrared light emitters. Indeed, upon increasing the Sn content, the bandgap of GeSn narrows and becomes direct, making this material system suitable for developing an efficient silicon-compatible emitter. With this perspective, microbridge PIN GeSn LEDs with a small footprint of 1520 μm2 are demonstrated, and their operation performance is investigated. The spectral analysis of the electroluminescence emission exhibits a peak at 2.31 μm, and it red-shifts slightly as the driving current increases. It is found that the microbridge LED operates at a dissipated power as low as 10.8 W at room temperature and just 3 W at 80 K. This demonstrated low operation power is comparable to that reported for LEDs having a significantly larger footprint reaching 106 μm2. The efficient thermal dissipation of the current design helped reduce the heat-induced optical losses, thus enhancing light emission. Further performance improvements are envisioned through thermal and optical simulations of the microbridge design. These simulations indicate that the use of GeSn-on-insulator substrate for developing a similar microbridge device is expected to improve the optical confinement toward the realization of electrically driven GeSn lasers.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Atalla, Mahmoud R. M.
Kim, Youngmin
Assali, Simone
Burt, Daniel
Nam, Donguk
Moutanabbir, Oussama
format Article
author Atalla, Mahmoud R. M.
Kim, Youngmin
Assali, Simone
Burt, Daniel
Nam, Donguk
Moutanabbir, Oussama
author_sort Atalla, Mahmoud R. M.
title Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power
title_short Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power
title_full Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power
title_fullStr Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power
title_full_unstemmed Extended-SWIR GeSn LEDs with reduced footprint and efficient operation power
title_sort extended-swir gesn leds with reduced footprint and efficient operation power
publishDate 2023
url https://hdl.handle.net/10356/169820
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