Flexible and printable composite ink for thermalmanagement of soft electronics

• Main Authors: Bark, Hyunwoo, Lee, Pooi See
• Other Authors: School of Materials Science and Engineering
• Format: Article
• Language: English
• Published: 2023
• Subjects: Engineering::Materials::Composite materials; Flexible Heat Sink; Galvanic Replacement
• Online Access: https://hdl.handle.net/10356/170875
• Institution: Nanyang Technological University

Since heat generation in electronic devices causes thermal failure, heat dissipation is of critical importance. Furthermore, deformable devices are subjected to mechanical stress, therefore, mechanically stable thermal management material should be considered. Herein, a strategy for printable, therm...