Flexible and printable composite ink for thermalmanagement of soft electronics

Since heat generation in electronic devices causes thermal failure, heat dissipation is of critical importance. Furthermore, deformable devices are subjected to mechanical stress, therefore, mechanically stable thermal management material should be considered. Herein, a strategy for printable, therm...

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Bibliographic Details
Main Authors: Bark, Hyunwoo, Lee, Pooi See
Other Authors: School of Materials Science and Engineering
Format: Article
Language:English
Published: 2023
Subjects:
Online Access:https://hdl.handle.net/10356/170875
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Institution: Nanyang Technological University
Language: English
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