The study of Ni-Sn transient liquid phase bonded joints under high temperatures

• المؤلفون الرئيسيون: Yan, Guangxu, Bhowmik, Ayan, Gill, Vincent, Gan, Chee Lip, Chen, Zhong
• مؤلفون آخرون: School of Materials Science and Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2023
• الموضوعات: Engineering::Materials; Microstructure Evolution; Thermal Reliability
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/170909
• المؤسسة: Nanyang Technological University

To develop new electronic packaging techniques for harsh environments, the microstructure and associated mechanical properties of Ni-Sn transient liquid phase (TLP) bonded joints at high temperatures have been investigated in this work. The effect of bonding temperature (from 400 °C to 700 °C) on th...