The study of Ni-Sn transient liquid phase bonded joints under high temperatures
To develop new electronic packaging techniques for harsh environments, the microstructure and associated mechanical properties of Ni-Sn transient liquid phase (TLP) bonded joints at high temperatures have been investigated in this work. The effect of bonding temperature (from 400 °C to 700 °C) on th...
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| Main Authors: | , , , , |
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| 其他作者: | |
| 格式: | Article |
| 語言: | English |
| 出版: |
2023
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/170909 |
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