Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-b...

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Bibliographic Details
Main Authors: Tay, Yu Shan, Yang, L., Zhang, Hao, Kor, Katherine Hwee Boon, Zhang, Li, Liu, H., Gill, V., Lambourne, A., Li, K. H. H., Chen, Z., Gan, Chee Lip
Other Authors: School of Materials Science and Engineering
Format: Article
Language:English
Published: 2024
Subjects:
Engineering::Materials
NanoCu Die Attach
Phthalonitrile-Based Encapsulant
Online Access:https://hdl.handle.net/10356/173088
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Institution: Nanyang Technological University
Language: English
Description
Summary:Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration.

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