Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

• المؤلفون الرئيسيون: Tay, Yu Shan, Yang, L., Zhang, Hao, Kor, Katherine Hwee Boon, Zhang, Li, Liu, H., Gill, V., Lambourne, A., Li, K. H. H., Chen, Z., Gan, Chee Lip
• مؤلفون آخرون: School of Materials Science and Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2024
• الموضوعات: Engineering::Materials; NanoCu Die Attach; Phthalonitrile-Based Encapsulant
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/173088

Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration.