Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-b...

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Main Authors: Tay, Yu Shan, Yang, L., Zhang, Hao, Kor, Katherine Hwee Boon, Zhang, Li, Liu, H., Gill, V., Lambourne, A., Li, K. H. H., Chen, Z., Gan, Chee Lip
Other Authors: School of Materials Science and Engineering
Format: Article
Language:English
Published: 2024
Subjects:
Engineering::Materials
NanoCu Die Attach
Phthalonitrile-Based Encapsulant
Online Access:https://hdl.handle.net/10356/173088
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Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-173088
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spelling sg-ntu-dr.10356-1730882024-01-12T15:47:31Z Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment Tay, Yu Shan Yang, L. Zhang, Hao Kor, Katherine Hwee Boon Zhang, Li Liu, H. Gill, V. Lambourne, A. Li, K. H. H. Chen, Z. Gan, Chee Lip School of Materials Science and Engineering School of Mechanical and Aerospace Engineering Rolls-Royce@NTU Corporate Lab Temasek Laboratories @ NTU Engineering::Materials NanoCu Die Attach Phthalonitrile-Based Encapsulant Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration. Submitted/Accepted version This study is supported under the RIE2020 Industry Alignment Fund – Industry Collaboration Projects (IAF-ICP) Funding Initiative, as well as cash and in-kind contribution from Rolls-Royce Singapore Pte Ltd. 2024-01-11T06:09:21Z 2024-01-11T06:09:21Z 2023 Journal Article Tay, Y. S., Yang, L., Zhang, H., Kor, K. H. B., Zhang, L., Liu, H., Gill, V., Lambourne, A., Li, K. H. H., Chen, Z. & Gan, C. L. (2023). Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment. Microelectronics Reliability, 150, 115115-. https://dx.doi.org/10.1016/j.microrel.2023.115115 0026-2714 https://hdl.handle.net/10356/173088 10.1016/j.microrel.2023.115115 2-s2.0-85174682134 150 115115 en IAF-ICP Microelectronics Reliability © 2023 Elsevier Ltd. All rights reserved. This article may be downloaded for personal use only. Any other use requires prior permission of the copyright holder. The Version of Record is available online at http://doi.org/10.1016/j.microrel.2023.115115. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Materials
NanoCu Die Attach
Phthalonitrile-Based Encapsulant
spellingShingle Engineering::Materials
NanoCu Die Attach
Phthalonitrile-Based Encapsulant
Tay, Yu Shan
Yang, L.
Zhang, Hao
Kor, Katherine Hwee Boon
Zhang, Li
Liu, H.
Gill, V.
Lambourne, A.
Li, K. H. H.
Chen, Z.
Gan, Chee Lip
Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
description Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-based encapsulant, for the fabrication of a packaged gas sensor for harsh environment applications. This is done through a series of test protocols and reliability assessments developed to simulate operations at high temperature and under strong vibration.
author2 School of Materials Science and Engineering
author_facet School of Materials Science and Engineering
Tay, Yu Shan
Yang, L.
Zhang, Hao
Kor, Katherine Hwee Boon
Zhang, Li
Liu, H.
Gill, V.
Lambourne, A.
Li, K. H. H.
Chen, Z.
Gan, Chee Lip
format Article
author Tay, Yu Shan
Yang, L.
Zhang, Hao
Kor, Katherine Hwee Boon
Zhang, Li
Liu, H.
Gill, V.
Lambourne, A.
Li, K. H. H.
Chen, Z.
Gan, Chee Lip
author_sort Tay, Yu Shan
title Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
title_short Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
title_full Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
title_fullStr Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
title_full_unstemmed Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
title_sort ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
publishDate 2024
url https://hdl.handle.net/10356/173088
_version_ 1789483163562541056

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