Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

• Main Authors: Tay, Yu Shan, Yang, L., Zhang, Hao, Kor, Katherine Hwee Boon, Zhang, Li, Liu, H., Gill, V., Lambourne, A., Li, K. H. H., Chen, Z., Gan, Chee Lip
• 其他作者: School of Materials Science and Engineering
• 格式: Article
• 語言: English
• 出版: 2024
• 主題: Engineering::Materials; NanoCu Die Attach; Phthalonitrile-Based Encapsulant
• 在線閱讀: https://hdl.handle.net/10356/173088

Current gas sensors are typically graded for performance up to 100 °C and limited by the materials used in their packaging. This work aims to select, design and investigate novel materials for die attach and encapsulation technology, such as copper nanoparticles-based die attach and phthalonitrile-b...