Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling

Based on the structure of natural nacres, laminated metal materials have been successfully developed to possess desirable mechanical properties for diverse engineering applications. These heterostructured (HS) laminates consist of layers with different mechanical performances, resulting in asynchron...

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Main Authors: Lu, Xiaochong, Zhao, Jianfeng, Wang, Qi, Ran, Hao, Wang, Qingyuan, Huang, Chongxiang
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2024
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Online Access:https://hdl.handle.net/10356/173753
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1737532024-03-01T15:40:46Z Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling Lu, Xiaochong Zhao, Jianfeng Wang, Qi Ran, Hao Wang, Qingyuan Huang, Chongxiang School of Electrical and Electronic Engineering Engineering Heterostructured laminate Strain and stress partition Based on the structure of natural nacres, laminated metal materials have been successfully developed to possess desirable mechanical properties for diverse engineering applications. These heterostructured (HS) laminates consist of layers with different mechanical performances, resulting in asynchronous deformation and intricate stress/strain partitioning behavior. These distinctive phenomena are crucial in achieving the strength-ductility synergy of HS laminates. Nonetheless, further investigations are imperative to gain a comprehensive understanding of local stress and strain evolutions during deformation, and to thoroughly explore the influence of stress/strain partition on the mechanical behavior of the HS laminates. This study utilized the conventional mechanism-based strain gradient (CMSG) plasticity theory to conduct finite element simulations. The tensile deformation of HS laminate comprising nanostructured (NS) bronze and coarse-grained (CG) copper layers was simulated as a benchmark. The simulation results revealed the following: (1) Stress partition and stress transfer between the layers occur during deformation and are influenced by the layer thickness; (2) Both strain partition and strain banding exist in the HS laminates with relatively thinner layers, and the formation of dispersed strain bands is related to the plastic strain gradient; (3) Heterogeneous deformation promotes strain delocalization and strain hardening, consequently leading to improved uniform elongation. This study provides valuable insights into the significant effect of stress/strain partition on the strength-ductility synergy of HS laminates from the perspective of constitutive modeling. Published version This work was supported by the National Natural Science Foundation of China (92263201, 51931003, 12202423, 12302280), the Fundamental Research Funds for the Central Universities (2022SCU12094), the Project funded by China Postdoctoral Science Foundation (2022M722253), the Sichuan University Postdoctoral Interdisciplinary Innovation Fund (JCXK2238). 2024-02-26T06:58:40Z 2024-02-26T06:58:40Z 2023 Journal Article Lu, X., Zhao, J., Wang, Q., Ran, H., Wang, Q. & Huang, C. (2023). Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling. Results in Engineering, 20, 101631-. https://dx.doi.org/10.1016/j.rineng.2023.101631 2590-1230 https://hdl.handle.net/10356/173753 10.1016/j.rineng.2023.101631 2-s2.0-85179492173 20 101631 en Results in Engineering © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/bync-nd/4.0/). application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering
Heterostructured laminate
Strain and stress partition
spellingShingle Engineering
Heterostructured laminate
Strain and stress partition
Lu, Xiaochong
Zhao, Jianfeng
Wang, Qi
Ran, Hao
Wang, Qingyuan
Huang, Chongxiang
Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling
description Based on the structure of natural nacres, laminated metal materials have been successfully developed to possess desirable mechanical properties for diverse engineering applications. These heterostructured (HS) laminates consist of layers with different mechanical performances, resulting in asynchronous deformation and intricate stress/strain partitioning behavior. These distinctive phenomena are crucial in achieving the strength-ductility synergy of HS laminates. Nonetheless, further investigations are imperative to gain a comprehensive understanding of local stress and strain evolutions during deformation, and to thoroughly explore the influence of stress/strain partition on the mechanical behavior of the HS laminates. This study utilized the conventional mechanism-based strain gradient (CMSG) plasticity theory to conduct finite element simulations. The tensile deformation of HS laminate comprising nanostructured (NS) bronze and coarse-grained (CG) copper layers was simulated as a benchmark. The simulation results revealed the following: (1) Stress partition and stress transfer between the layers occur during deformation and are influenced by the layer thickness; (2) Both strain partition and strain banding exist in the HS laminates with relatively thinner layers, and the formation of dispersed strain bands is related to the plastic strain gradient; (3) Heterogeneous deformation promotes strain delocalization and strain hardening, consequently leading to improved uniform elongation. This study provides valuable insights into the significant effect of stress/strain partition on the strength-ductility synergy of HS laminates from the perspective of constitutive modeling.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Lu, Xiaochong
Zhao, Jianfeng
Wang, Qi
Ran, Hao
Wang, Qingyuan
Huang, Chongxiang
format Article
author Lu, Xiaochong
Zhao, Jianfeng
Wang, Qi
Ran, Hao
Wang, Qingyuan
Huang, Chongxiang
author_sort Lu, Xiaochong
title Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling
title_short Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling
title_full Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling
title_fullStr Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling
title_full_unstemmed Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling
title_sort effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling
publishDate 2024
url https://hdl.handle.net/10356/173753
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