Un-fill electronics packaging material

• Main Author: Soh, Pei Xuan
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2024
• Subjects: Engineering
• Online Access: https://hdl.handle.net/10356/176057
• Institution: Nanyang Technological University

This project examines the methodologies used to weaken or remove underfill and allow for successful component desoldering from the Printed Circuit Board (PCB). With increasing usage of underfill to ensure solder joint reliability, especially for use in Integrated Circuit (IC) packaging such as Ball...