Un-fill electronics packaging material
This project examines the methodologies used to weaken or remove underfill and allow for successful component desoldering from the Printed Circuit Board (PCB). With increasing usage of underfill to ensure solder joint reliability, especially for use in Integrated Circuit (IC) packaging such as Ball...
Saved in:
Main Author: | Soh, Pei Xuan |
---|---|
Other Authors: | Gan Chee Lip |
Format: | Final Year Project |
Language: | English |
Published: |
Nanyang Technological University
2024
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/176057 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Micro-deformation characterization of electronic packaging materials and assemblies
by: Sun, Yao Feng
Published: (2010) -
Chemo-thermo-viscoelastic characterization and material modeling of electronic packaging moulding compound materials
by: Neo, Raynard Guan Hock
Published: (2008) -
Application of soft material for reclamation fill
by: Chua, Feng Jun, et al.
Published: (2014) -
Novel high temperature polymeric encapsulation material for extreme environment electronics packaging
by: Phua, Eric Jian Rong, et al.
Published: (2019) -
EPS-filled used tires as a light weight construction fill material
by: Isao Ishibashi, et al.
Published: (2018)