Un-fill electronics packaging material

This project examines the methodologies used to weaken or remove underfill and allow for successful component desoldering from the Printed Circuit Board (PCB). With increasing usage of underfill to ensure solder joint reliability, especially for use in Integrated Circuit (IC) packaging such as Ball...

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Bibliographic Details
Main Author: Soh, Pei Xuan
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2024
Subjects:
Online Access:https://hdl.handle.net/10356/176057
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Institution: Nanyang Technological University
Language: English

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