Thermal measurements and modelling of electronic packages
In this study, thermal characterization experiments were carried out under natural and forced cooling conditions for three kinds of TAB packages with and without die attach and heat sink. Both the electrical test method and infrared imaging techniques were used to investigate the junction temperatur...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2009
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/19981 |
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