Thermal measurements and modelling of electronic packages

In this study, thermal characterization experiments were carried out under natural and forced cooling conditions for three kinds of TAB packages with and without die attach and heat sink. Both the electrical test method and infrared imaging techniques were used to investigate the junction temperatur...

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Bibliographic Details
Main Author: Yang, Li Yu
Other Authors: Leong, Kai Choong
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19981
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Institution: Nanyang Technological University
Language: English