Advanced electronic packaging substrate (ball grid array)
In this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5988 |
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| Institution: | Nanyang Technological University |