Advanced electronic packaging substrate (ball grid array)

In this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties.

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Bibliographic Details
Main Author: Li, Jianjun.
Other Authors: Yi, Sung
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5988
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-5988
record_format dspace
spelling sg-ntu-dr.10356-59882023-03-11T17:10:03Z Advanced electronic packaging substrate (ball grid array) Li, Jianjun. Yi, Sung School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing In this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties. Master of Science (Precision Engineering) 2008-09-17T11:04:18Z 2008-09-17T11:04:18Z 2001 2001 Thesis http://hdl.handle.net/10356/5988 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing
spellingShingle DRNTU::Engineering::Manufacturing
Li, Jianjun.
Advanced electronic packaging substrate (ball grid array)
description In this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties.
author2 Yi, Sung
author_facet Yi, Sung
Li, Jianjun.
format Theses and Dissertations
author Li, Jianjun.
author_sort Li, Jianjun.
title Advanced electronic packaging substrate (ball grid array)
title_short Advanced electronic packaging substrate (ball grid array)
title_full Advanced electronic packaging substrate (ball grid array)
title_fullStr Advanced electronic packaging substrate (ball grid array)
title_full_unstemmed Advanced electronic packaging substrate (ball grid array)
title_sort advanced electronic packaging substrate (ball grid array)
publishDate 2008
url http://hdl.handle.net/10356/5988
_version_ 1761781287710883840