Advanced electronic packaging substrate (ball grid array)
In this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties.
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sg-ntu-dr.10356-59882023-03-11T17:10:03Z Advanced electronic packaging substrate (ball grid array) Li, Jianjun. Yi, Sung School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing In this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties. Master of Science (Precision Engineering) 2008-09-17T11:04:18Z 2008-09-17T11:04:18Z 2001 2001 Thesis http://hdl.handle.net/10356/5988 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Manufacturing Li, Jianjun. Advanced electronic packaging substrate (ball grid array) |
description |
In this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties. |
author2 |
Yi, Sung |
author_facet |
Yi, Sung Li, Jianjun. |
format |
Theses and Dissertations |
author |
Li, Jianjun. |
author_sort |
Li, Jianjun. |
title |
Advanced electronic packaging substrate (ball grid array) |
title_short |
Advanced electronic packaging substrate (ball grid array) |
title_full |
Advanced electronic packaging substrate (ball grid array) |
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Advanced electronic packaging substrate (ball grid array) |
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Advanced electronic packaging substrate (ball grid array) |
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advanced electronic packaging substrate (ball grid array) |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/5988 |
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1761781287710883840 |