Development of an alternative rework process for ceramic ball grid array 256 (CBGA256) assembly

In the assembly of ceramic ball grid array (CBGA) packages to a printed circuit board, various factors could affect the functionality of the package. A rework operation which removes and replaces the defective component is thus required. However, the deficiency of the site preparation has become the...

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Bibliographic Details
Main Author: Chua, Kai Meng.
Other Authors: Lahiri Syamal Kumar
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19926
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Institution: Nanyang Technological University
Language: English