Development of an alternative rework process for ceramic ball grid array 256 (CBGA256) assembly

by Chua, Kai Meng.
Published 2009

Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers

by Wang, Jun Jun, Zhang, Yue Ping, Chua, Kai Meng, Lu, Albert Chee Wai
Published 2009

Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios

by Wai, L. L., Sun, Mei, Liu, Duixian, Zhang, Yue Ping, Chua, Kai Meng
Published 2010

Integration of grid array antenna in chip package for highly integrated 60-GHz radios

by Guo, Y. X., Wai, L. L., Sun, Mei, Zhang, Yue Ping, Chua, Kai Meng
Published 2010

Integration of Yagi antenna in LTCC package for differential 60-GHz radio

by Gaucher, B. P., Wai, L. L., Zhang, Yue Ping, Sun, Mei, Liu, Duixian, Chua, Kai Meng
Published 2010