Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios

• Main Authors: Wai, L. L., Sun, Mei, Liu, Duixian, Zhang, Yue Ping, Chua, Kai Meng
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Article
• 語言: English
• 出版: 2010
• 主題: DRNTU::Engineering::Electrical and electronic engineering
• 在線閱讀: https://hdl.handle.net/10356/91527; http://hdl.handle.net/10220/6267
• 機構: Nanyang Technological University

This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly techn...