Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios
This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly techn...
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Main Authors: | Wai, L. L., Sun, Mei, Liu, Duixian, Zhang, Yue Ping, Chua, Kai Meng |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Article |
Language: | English |
Published: |
2010
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/91527 http://hdl.handle.net/10220/6267 |
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Institution: | Nanyang Technological University |
Language: | English |
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