Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios

This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly techn...

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Bibliographic Details
Main Authors: Wai, L. L., Sun, Mei, Liu, Duixian, Zhang, Yue Ping, Chua, Kai Meng
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2010
Subjects:
Online Access:https://hdl.handle.net/10356/91527
http://hdl.handle.net/10220/6267
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Institution: Nanyang Technological University
Language: English

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