Electronic packaging assembly concept for computer casing
New processor and software developments are appearing with ever increasing frequency on the market. Resistance to impact, vibration and temperature as well as short assembly times are necessary for efficient production. Due to the steadily increasing demand, computer systems must be frequently enhan...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5372 |
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| Institution: | Nanyang Technological University |