Electronic packaging assembly concept for computer casing

New processor and software developments are appearing with ever increasing frequency on the market. Resistance to impact, vibration and temperature as well as short assembly times are necessary for efficient production. Due to the steadily increasing demand, computer systems must be frequently enhan...

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Bibliographic Details
Main Author: Wee, Yap San.
Other Authors: Lye, Sun Woh
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/5372
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Institution: Nanyang Technological University

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