Conductive bridge resistive random access memory (CBRAM)

Modern computer architecture incorporates three principal memory technologies: DRAM, SRAM, and Flash memory. However, due to the scaling limitation of charge-based memory technologies, emerging memory technologies are looking to replace these conventional memory technologies by introducing a new...

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Main Author: Chua, Wei Liang
Other Authors: Ang Diing Shenp
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2024
Subjects:
Online Access:https://hdl.handle.net/10356/176971
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1769712024-05-24T15:44:27Z Conductive bridge resistive random access memory (CBRAM) Chua, Wei Liang Ang Diing Shenp School of Electrical and Electronic Engineering EDSAng@ntu.edu.sg Engineering Conductive bridge resistive random access memory CBRAM Modern computer architecture incorporates three principal memory technologies: DRAM, SRAM, and Flash memory. However, due to the scaling limitation of charge-based memory technologies, emerging memory technologies are looking to replace these conventional memory technologies by introducing a new storage class memory (SCM). It combines the high speed and endurance characteristics of DRAM with the non-volatility of Flash Memory, which is urgently needed to fulfill the computing needs of this internet-of-things era. Conductive bridge random access memory (CBRAM) stands out as one of the most promising candidates for future memory technology, which relies on the migration of metal ions and subsequent redox reactions. Its appeal lies in its low operating voltage, minimal energy consumption, exceptional scalability, large memory window, and versatile switching characteristics. Our main objective is to enhance our comprehension of the operating principle and performance characteristics through various tests, such as current-voltage measurement and direct current (DC) endurance, while simultaneously striving to enhance its overall reliability. In this final year project (FYP), device characterization of Ag/GeTe/GeS/Pt-CBRAM device is extensively studied. Therefore, this report delves into an extensive literature review encompassing the different memory technologies, offering comprehensive insights into their respective operating principles and performance characteristics. Additionally, it explains the experimental methodologies employed in conducting the tests, providing detailed explanations of the procedures and setups utilized. Furthermore, this report analyses and discusses the outcomes of these tests, deriving insightful conclusions regarding the device behavior and performance of the tested devices. Bachelor's degree 2024-05-23T13:28:14Z 2024-05-23T13:28:14Z 2024 Final Year Project (FYP) Chua, W. L. (2024). Conductive bridge resistive random access memory (CBRAM). Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/176971 https://hdl.handle.net/10356/176971 en A2020-231 application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering
Conductive bridge resistive random access memory
CBRAM
spellingShingle Engineering
Conductive bridge resistive random access memory
CBRAM
Chua, Wei Liang
Conductive bridge resistive random access memory (CBRAM)
description Modern computer architecture incorporates three principal memory technologies: DRAM, SRAM, and Flash memory. However, due to the scaling limitation of charge-based memory technologies, emerging memory technologies are looking to replace these conventional memory technologies by introducing a new storage class memory (SCM). It combines the high speed and endurance characteristics of DRAM with the non-volatility of Flash Memory, which is urgently needed to fulfill the computing needs of this internet-of-things era. Conductive bridge random access memory (CBRAM) stands out as one of the most promising candidates for future memory technology, which relies on the migration of metal ions and subsequent redox reactions. Its appeal lies in its low operating voltage, minimal energy consumption, exceptional scalability, large memory window, and versatile switching characteristics. Our main objective is to enhance our comprehension of the operating principle and performance characteristics through various tests, such as current-voltage measurement and direct current (DC) endurance, while simultaneously striving to enhance its overall reliability. In this final year project (FYP), device characterization of Ag/GeTe/GeS/Pt-CBRAM device is extensively studied. Therefore, this report delves into an extensive literature review encompassing the different memory technologies, offering comprehensive insights into their respective operating principles and performance characteristics. Additionally, it explains the experimental methodologies employed in conducting the tests, providing detailed explanations of the procedures and setups utilized. Furthermore, this report analyses and discusses the outcomes of these tests, deriving insightful conclusions regarding the device behavior and performance of the tested devices.
author2 Ang Diing Shenp
author_facet Ang Diing Shenp
Chua, Wei Liang
format Final Year Project
author Chua, Wei Liang
author_sort Chua, Wei Liang
title Conductive bridge resistive random access memory (CBRAM)
title_short Conductive bridge resistive random access memory (CBRAM)
title_full Conductive bridge resistive random access memory (CBRAM)
title_fullStr Conductive bridge resistive random access memory (CBRAM)
title_full_unstemmed Conductive bridge resistive random access memory (CBRAM)
title_sort conductive bridge resistive random access memory (cbram)
publisher Nanyang Technological University
publishDate 2024
url https://hdl.handle.net/10356/176971
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