Optimization of sintering profiles for enhanced bonding of NanoCu particles
To address the stringent demands of power electronics, such as increased current densities and higher operating temperatures, progressive innovations in packaging and assembly technologies are essential. The performance and reliability of these electronic systems rely heavily on the robustness of in...
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| 格式: | Final Year Project |
| 語言: | English |
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Nanyang Technological University
2024
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/181028 |
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