Optimization of sintering profiles for enhanced bonding of NanoCu particles

• المؤلف الرئيسي: Lie, Joselyn
• مؤلفون آخرون: Gan Chee Lip
• التنسيق: Final Year Project
• اللغة: English
• منشور في: Nanyang Technological University 2024
• الموضوعات: Engineering; Nano-copper; Sintering profile; NanoCu
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/181028

To address the stringent demands of power electronics, such as increased current densities and higher operating temperatures, progressive innovations in packaging and assembly technologies are essential. The performance and reliability of these electronic systems rely heavily on the robustness of in...